Dirac and BES partner to offer Dirac-enabled BES chipsets to global headphone manufacturers
January 7, 2023
Headphone brands can now integrate BES chipsets that include award-winning Dirac Virtuo™ and Dirac Opteo™ software to deliver optimized performance in any headphone type.
LAS VEGAS, Nevada, January 7, 2023 — Swedish digital audio pioneer Dirac and leading multinational chipset maker BES today announced a partnership to pre-integrate the Dirac Virtuo™ and Dirac Opteo™ software onto BES chipsets to be used by leading headphone manufacturers. The announcement was made at CES 2023 at Dirac’s Venetian Suite.
The partnership enables the two companies to offer packaged Dirac-BES solutions that allow manufacturers to more quickly and efficiently equip headphones with premium-quality sound. boAt, Monoprice, and Sudio are the first headphone brands to leverage Dirac-enabled BES chipsets in their devices.
“Dirac is known for pioneering the industry’s most advanced digital signal processing solutions that are relied upon by many of the world’s blue chip technology brands across a range of markets,” said Nilo Casimiro, Product Lead at Dirac. “However, increasingly key to our growth strategy are partnerships with leading chipset designers like BES to integrate our solutions directly onto their hardware – delivering tremendous value for our shared OEM customers. This partnership with BES represents an important step forward in our mission to deliver superior sound for everyone.”
Dirac Virtuo™ employs a high-resolution binaural room impulse response technology to restore speaker crosstalk and correct the stereo soundstage. With Dirac Virtuo™, sound seemingly comes from a pair of premium stereo speakers in front of the listener, rather than from inside their head – creating a truer, more accurate stereo soundstage than regular headphones can deliver.
Dirac Opteo™ elevates audio performance to altogether new levels using patented technologies that perfect the sound via data-driven, semi-automatic tuning and advanced audio processing features for richer vocals and deeper bass.
“BES is dedicated to advancing state of the art consumer audio products, and this new partnership with Dirac helps further catapult us to the forefront of headphone innovation,” said Guoguang Zhao, the General Manager of BES “Our premium-quality chipsets now pre-integrated Dirac make it easier than ever for manufacturers to equip their headphone with improved audio quality that deliver better listening experiences for consumers worldwide.”
Dirac has formed similar partnerships with chipset designers ADI and NXP in the automotive and home theater market segments. This collaboration with BES represents the first time Dirac has partnered with a chipset designer in the headphone market.
Dirac-enabled BES chipsets will be on display and available for demo at CES 2023 at Dirac’s Venetian Suite 3-221.
For more information on Dirac, visit www.dirac.com. For more information on BES, visit www.bestechnic.com. For hi-res photography, click here.
About BES:
Bestechnic (BES) is an industry leader in the design of low-power wireless audio and video SoCs. It has excellent R&D capabilities in acoustics, wireless communication, embedded AI, low-power high-performance SoCs, and comprehensive software architecture. The company provides main control chips in smart wearable devices and home appliances for world-renowned brands such as Samsung, Xiaomi, and Harman etc.
About Dirac:
Dirac develops digital software solutions that create a significantly improved sound experience for all types of sound systems. Our customers include enterprises, such as sound system manufacturers and streaming services, as well as consumers. Dirac is a global company with headquarters in Uppsala, Sweden and R&D facilities in Copenhagen, Denmark and Bangalore, India, with representation in Greater China, Germany, Japan, Korea, and USA.